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WO Rejected

Assembly Work Order

Order Date	2004-04-01	Routing	Assembly
WO No	333000801	Requester	Mary Liu
PO No	200000801	Department	Production
Wafer Device	ABC123	Lot Type	Production
Part No	ABC1234	Priority	Normal
Supplier	Foundry1	Due Date	2004-06-01
Ship To	FIC	Revision No	0

SPECIFICATION

Source Part No		Substrate
PKG/LEAD/Body Size		D/A Epoxy
Leadframe		Solder Ball
Wire		Marking Spec
Mold Compound		Bond Diagram
Tray Spec

ITEMS

Line No	Source Lot No	Source Qty	UOM	Comment	Lot No.	Qty	UOM	Good Qty Id Method
10	ABC123	100	Die	NIL	ABC123a	100	Die	Blind Built
20	ABC124	100	Die	NIL	ABC124a	100	Die	Ink
	Total Source Qty	200			Total Qty	200

INSTRUCTIONS

QTY	Process	Description	Unit Price	Amount


	Total Price
	Min Charge

NOTES

N/A

INTERNAL NOTES

N/A

ATTACHMENT

../Buy.xls

APPROVAL

Role	Name	Rejected By	Date	Comments
Manager	Jim Zhang	-	2004-04-01	N/A
QA	Jim Zhang	-	2004-04-01	N/A
VP	Lilian Chien	Lilian Chien	2004-04-02	Overprojected Demand

COMMENTS