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Buy > Unconfirmed WO: Details
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Unconfirmed WO: Details
   


Assembly Work Order


Order Date 2004-04-01 Routing Assembly
WO No 333000801 Requester Mary Liu
PO No 200000801 Department Production
Wafer Device ABC123 Lot Type Production
Part No ABC1234 Priority Normal
Supplier Foundry1 Due Date 2004-06-01
Ship To FIC Revision No 0

SPECIFICATION

Source Part No   Substrate  
PKG/LEAD/Body Size   D/A Epoxy  
Leadframe   Solder Ball  
Wire   Marking Spec  
Mold Compound   Bond Diagram  
Tray Spec      

ITEMS

Line No Source Lot No Source Qty UOM Comment Lot No. Qty UOM Good Qty Id
Method
10 ABC123 100 Die NIL ABC123a 100 Die Blind Built
20 ABC124 100 Die NIL ABC124a 100 Die Ink
  Total Source Qty 200     Total Qty 200    

INSTRUCTIONS

QTY Process Description Unit Price Amount
         
         
  Total Price  
  Min Charge  

NOTES

N/A

INTERNAL NOTES

N/A

ATTACHMENT

../Buy.xls

APPROVAL

Role Name Rejected By Date Comments
Manager Jim Zhang - 2004-04-01 N/A
QA Jim Zhang - 2004-04-01 N/A
VP Lilian Chien Lilian Chien 2004-04-02 Overprojected Demand

       

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