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WIP (Horizontal)

Supplier	Routing Wafer Device Part No History
PO No	WO No Lot No
Date	-

Standard | Horizontal

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Supplier	Die Saw	Forming	Wire Bonding	Trimming	Bin1	Bin2	Part No	Production Order Number	Buyer's Item Number	Good Die Quantity	Device	Topmark	Date Code	Buyer Lot Number	Supplier Lot Number	Actual Completion Date	Routing	Received Wafer Qty	Start Wafer Qty	Processed Wafer Qty	Processed Die Qty	Completed Wafer Qty	Completed Die Qty	Downgraded Item Number	Downgraded Qty	Scraped Wafer Quantity	Purchase Order Number	Estimated Completion Date	Order Date	Process Name	Process Status	Promised Completion Date	Received Date	Received Die Qty	Runcard Number	Scraped Die Qty	Start Date	Start Die Qty	Step Name	Wafer ID	Warehouse Status	Location	Supplier Item Number	Report Date	Ship Date	Ship To Date Wafer Quantity	Ship To Date Die Quantity	Shipped Wafer Quantity	Shipped Die Quantity	Ordered Wafer Quantity	Ordered Die Quantity	Wafer Quantity in Supplier's warehouse	Die Quantity in Supplier's warehouse	Process Start Date	Process Position	Lot Type	Hold Reason	Production Order Line No.	Package Type	IC Device
VATE	0	0	0	50			IS61LV12816-15B	269023419						W4641600V													600006396				Completed		2004-01-02 00:00:00
LINGSEN	100	200	250	0			IS61LV1024L-10T	269025054						W4485800L7													600006830				Active		2003-11-20 00:00:00
UTAC	0	0	11001	0			IS61LV1024L-12B	269024794						W4485800US													600006748				Active		2003-11-20 00:00:00
KINGPAK	0	1000	100	0			IS61LV1024L-12B	269024444						W4485800Q4													600006661				Active		2003-12-24 00:00:00
CHANKTEK	0	100	1000	500			IS61LV1024-10J	269024939						W4485800H6													600006794				Completed		2003-12-24 00:00:00

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