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Module

Report Layout

Layout Name

AVAILABLE REGIONS

Query

Result

	Column/Field	Description
1	PRODUCTIONORDERNUMBER	Production Order Number from Buyer
2	BUYERITEMNUMBER	Buyer's Item Number
3	GOODDIEQUANTITY	Good Die Quantity
4	DEVICE	Wafer manufacturing device
5	TOPMARK	Topmark of finished goods
6	DATECODE	Code to designate the manufacturing date of product
7	BUYERLOTNUMBER	Buyer's Lot Number
8	SUPPLIERLOTNUMBER	Supplier's Lot Number
9	ACTUALCOMPLETIONDATE	Date on which the production process is completed
10	ROUTING	Routing such as foundry, wafer sort, assembly or final test.
11	RECEIVEDWAFERQUANTITY	No. of wafers received for the production process
12	STARTWAFERQUANTITY	Wafer quantity at start of the process
13	PROCESSEDWAFERQUANTITY	No. of wafers that is active in the production process
14	PROCESSEDDIEQUANTITY	No. of dies that is active in the production process
15	COMPLETEDWAFERQUANTITY	No. of wafers that has been completed in the manufacturing process
16	COMPLETEDDIEQUANTITY	No. of dies that has been completed in the manufacturing process
17	DOWNGRADEDITEMNUMBER	Item number for down-grade parts
18	DOWNGRADEDQUANTITY	Number of dies being downgraded to lower specs after production
19	SCRAPEDWAFERQUANTITY	Number of wafers being scrapped during the production process
20	PURCHASEORDERNUMBER	Purchase Order Number issued from Buyer
21	ESTIMATEDCOMPLETIONDATE	Revised completion date based on the current process situation
22	ORDERDATE	Date on which the production order is issued
23	PROCESSNAME	Process name within a routing as defined by supplier
24	PROCESSSTATUS	Straus of the process such as scheduled, active, hold, completed, or shipped
25	PROMISEDCOMPLETIONDATE	Promised completion date or committed date
26	RECEIVEDDATE	Date on which the material is received from buyer
27	RECEIVEDDIEQUANTITY	No. of dies received for the manufacturing process
28	RUNCARDNUMBER	Also called traveler no: a number for supplier to track the manufacturing process
29	SCRAPEDDIEQUANTITY	Number of dies being scrapped during the production process
30	STARTDATE	Date on which the manufacturing process began
31	STARTDIEQUANTITY	Die quantity at the start of the process
32	STEPNAME	Name of the detailed steps within a process
33	WAFERID	ID number assigned to wafer
34	WAREHOUSESTATUS	Status of warehouse of finished goods
35	LOCATION	Manufacturer's location, such as fab no, or factory no.
36	SUPPLIERITEMNUMBER	Supplier's item number
37	REPORTDATE	WIP report date
38	SHIPDATE	Date which the current shipment is made
39	SHIPTODATEWAFERQUANTITY	The accumulated wafer quantity that has been shipped up to this date
40	SHIPTODATEDIEQUANTITY	The accumulated die quantity that has been shipped up to this date
41	SHIPPEDWAFERQUANTITY	Ship quantity in wafer
42	SHIPPEDDIEQUANTITY	The die quantity in the current shipment
43	ORDEREDWAFERQUANTITY	Wafer Quantity from PO
44	ORDEREDDIEQUANTITY	Die Quantity from PO
45	WHWAFERQTY	Wafer quantity stored in supplier`s warehouse after the completion of manufacturing process
46	WHDIEQTY	Die quantity stored in supplier`s warehouse after the completion of manufacturing process
47	DPROCESSSTART	Date on which the process is started
48	PROCESSPOSITION	Process Position
49	VCLOTTYPE	Lot Type
50	HOLDREASON	Hold Reason
51	PRODUCTIONORDERLINENO	Production Order Line No.
52	PACKAGETYPE	Package Type
53	ICDEVICE	IC Device